Polyamide hot melt adhesives are used in a variety of industrial applications. Most polyamide adhesives possess a broad range of adhesive properties, and are characterized as exhibiting excellent adhesion to a wide variety of substrates, bonding well to porous substrates.

They also demonstrate good chemical and oil resistance, and show good adhesion over a wide range of service temperatures.  

Most polyamides, particularly the dimer acid polyamides, are prone to oxidation and must be stabilized by antioxidants.  

Although the stabilizers will vary with the polyamide, the most common antioxidants that are used are hindered phenols, phosphites, phosphates, and hindered aromatic amines.  

Generally, a blend of antioxidants is used. Ciba® IRGANOX® 1098, a phenolic antioxidant, is able to stabilize polyamide hot melt adhesives against degradation occurring at high temperatures.  

Alternative stabilizers are Ciba® IRGANOX® 245 and Ciba® IRGANOX® 5057, an aromatic amine, which may be used either alone or in combination with other antioxidants.

For more detailed recommendations regarding your particular application, please contact us.