Innovative Solutions for Printed Circuit Board
| Basics & Application (Slide 1) |
Primary image Front ----Solder Mask image on PCB --- Back
CHIP DEVICE
- Build-up layer---------->
- Core layer ----------> Multi-layer structure
- Build-up layer --------> |
| Description & Technology (Slide 2) |
Photo mask
Cover foil
Solder resist
Substrate |
1. Mixing 4. Radical polymerization
2. Coating 5. Development (remove unexposed area)
3. Predrying (20-30 min/80°C) 6. Thermal curing (epoxy-carboxylic acid
reaction) |
| Solution (Slide 3) |
Cu circuit image designed by etching resist Photoinitiator for etching resist: | all-colored image (mainly green) on PCB ( others products....) Prevents solder from being desposited on unnecessary parts during soldering, those preventing short circuits. Protect PCB as a permanent top coating from heat, moisture... Photoinitiators for solder resist: |
Link to Products Portfolio...Read more...
|
